PPT Slide
Objectives: To determine mechanisms by which DI water usage in rinse processes can be reduced without sacrificing overall wafer cleanliness
ESH Impact: Water use reduction will save money and conserve resources while increasing manufacturing productivity
Method of Approach: Rinse model development to focus on individual mechanisms of chemical contaminant removal from patterned and unpatterned wafers. Experimental methods to determine concentration profiles of chemical removal and verify model.