Accomplishments
We optimized several standard recipes for existing CMP cleaning processes in the hood by decreasing time and water consumption by as much as half, thereby increasing throughput
We successfully developed a baseline new process for cleaning post copper CMP wafers
We identified a chemical that had been missing from our cleaning process but which was necessary in order to meet the process specifications
We have set up an experimental matrix for optimizing our newly developed baseline Cu CMP clean process, and are currently carrying out those experiments