Initial Wafer Characterization -Metals, Particles & Microroughness

5/7/98


Click here to start


Table of Contents

Initial Wafer Characterization -Metals, Particles & Microroughness

Outline

Background and Motivation

SSRL TXRF - Background

Basic Operation of TXRF

TXRF Results - Selected Species

Applied Materials, KLA-Tencor: Background

Basic Operation of SP1

CZ P- Particle Data

EPI P/P- Particle Data

Polished EPI P/P- Particle Data

Polished EPI P/P+ Particle Data

Stanford University, Digital Instruments AFM

Basic Operation of AFM

Results of AFM Measurements

Key Issues

Definition of Sequential Wafers

ERC Wetbench, Rinse Water Analysis - TXRF

Next Steps

Author: Helms Group

Email: kwamee@leland.stanford.edu