HFC/IFC HDP Etch Study (Jun. 1997 - Aug. 1997)
Comparison of 0.35 ?m (nominal printed CD) vias etched with a 1-iodoheptafluoropropane process (left) and a 2-iodoheptafluoropropane process (right). Both processes exhibit significant via taper and low bulk resist selectivity. (Center of wafer)