HF/vapor Cleaning Drivers

• Enabling Process

  • ex. Using anhydrous HF to etch BPSG or TEOS with high selectivity to thermal oxide.

• Resource Reduction

  • Lower water, ultrapure N2, and exhaust (energy) usage.
  • Smaller chemical load in waste streams.
  • Smaller tool footprint.

• Higher Performance

  • Small geometry penetration.
  • Cluster tool integration.
    • AMAT Centura Platform

• Killer Application

  • ex. Etch thermal oxide with high selectivity to deposited oxide.

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