PPT Slide
Objectives: To understand the fundamental kinetics and mechanisms of CMP rinsing and determine the bottleneck of the rinse process.
ESH Impact: CMP is one of the fastest growing processes in IC manufacturing fabrication, and post CMP rinsing uses a large % of the total water usage. An understanding of the process will lead to the development of cleaning and rinsing processes which use less water and chemicals.
Method of Approach: A Quartz Crystal Microbalance is being used to investigate the adsorption and desorption of copper ions from the oxide surface.