Cu Deposition Mechanism (III)
J. Phys. Chem. B, 102, 7919 (1998)
Electrochem. Soc. Proc. PV98(13), 250 (1998)
- Cu nucleates preferentially at the defect sites of Si(100) surface.
- Cu nucleates preferentially at the step edges of Si(111) surface, and inhibits the step flow etching of Si.