Supercritical Fluid Drying
Use CO2 to replace water or polar solvents.
Low surface tension avoids capillary forces/ pattern collapse
Pump
SCCO2
Wafer
Chamber
Developer
Rinse Solution
Temperature Controller
23oC
35oC
N2 / CO2 combination used
Very fine features created
1999 NTT LSI Laboratories, Japan
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