Summary
1. Aqueous Alumina suspensions can be destabilized by
the application of an electric filed.
2. Copper can be removed simultaneously with the solids,
either by in situ precipitation or by plating out onto the
3. When Al2O3 slurry is put into cathode chamber, the
Al2O3 particles coagulate via “IEP” mechanism. When
it is put into anode chamber, coagulation may be
caused by “Ionic Strength Increase” or locally high
4. The presence of Fe3+ (up to 100ppm) may not
dramatically enhance the Al2O3 coagulation.
NSF/SRC Engineering Research Center for Environmentally Benign Semiconductor Manufacturing