PPT Slide
NSF/SRC
Engineering Research Center for Environmentally Benign Semiconductor Manufacturing
Device Characteristics
1
2
3
4
Single Die:
6390 ?m x 9700 ?m
0.3 cm
5 different
trench lengths
(5,10,20,50,
and 100 mm)
Trenches
500 ?m
480 ?m
20 ?m
20 ?m
0.5 ?m
1000 ?m
500
?m
1000 ?m
20 ?m
3000 ?m
2 ?m
250 ?m
Pad level
20 ?m
5
Die Layout
Circuit Layout
Varying trench lengths provide 5 cell constants.
Large cell constant - high conc.’s
Small cell constants - low conc.’s.
Thick poly-Si - low circuit R
Pads to be Al
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