PPT Slide
High thermal conductivity critical
FSG provides equivalent thermal properties to conventional oxides
ɯx thermal conductivity of Low k
High hardness critical for electromigration resistance, mechanical stability during CMP
FSG provides equivalent hardness to
ᡌx hardness of Low k SODs
Bulk Film Comparison vs. HSQ
Oxide-Like Bulk Film Properties Contribute to Integration Ease, Device Reliability