Cu DAMASCENE INTEGRATION
In Situ Plasma Treatment for Copper Oxide Removal
* Failed at epoxy/dielectric interface
** AMAT Electra Cu & Mirra Cu CMP + 500Å Barrier
In Situ Plasma Treatment Required for Good Cu/Barrier Adhesion
Thin Cu Oxide layer interferes with adhesion
Oxygen Detection by ESCA/XPS
Oxygen Atomic Concentration (%)