PPT Slide
Why is a low k barrier/etch stop necessary?
- Low k dielectric materials are required to reduce
RC time delay in ɘ.25 micron metal interconnects.
- Low k barrier/etch stop has a significant impact on
the effective k value of the damascene structure.
- The current barrier/etch stop candidate is SiN which
has a k > 7.
- Applied Materials has developed a barrier/
etch stop candidate with k < 5.0 (Barrier LOw k).